Biography
Derek Schuurman's includes working in for several years before returning to academia. His interest in technology began in his early teens playing with and . He is also interested in the bigger picture of ethics, faith, and technology.
He is author of the book and co-author of , both published by IVP Academic. He is also a regular contributor to the , and a .
Prof. Schuurman is a fellow of the , an associate fellow of the Kirby Liang Centre, and was made a senior member of the . He is a member of the , , , and serves as a book review editor for .
Research interests include , embedded systems and IoT, CS pedagogy, philosophy of technology, and faith and technology issues.
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Education
- BASc Electrical Engineering,
- MASc Electrical Engineering,
- PhD,
Academic Interests
- issues relating to faith and computer technology
- computer science pedagogy
- computing education in the majority world
- embedded systems and IoT
- robotics and computer vision
Recent talks
Professor Schuurman was selected as the for 2023-2024.
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- Derek C. Schuurman, , Christian Courier, February 5, 2024 ( format).
- Derek C. Schuurman, , IEEE Computer Magazine, Volume 57, Issue 9, September, 2024.
- Derek C. Schuurman, , Perspectives on Science and Christian Faith, Volume 75, Number 3, December 2023, 155-161.
- Derek C. Schuurman, , Christian Scholar's Review blog, January 20, 2023 (winner of a for a Topical Blog).
- Derek C. Schuurman, , Pro Rege, Vol. 46, No. 1, September, 2017, 4-11 (available also in Portuguese as ).
- Derek C. Schuurman, , Pro Rege, Vol. 44, No. 3, March, 2016, 14-20.
- Derek C. Schuurman, , Christian Scholar's Review, Volume XLIX, Number 2, Winter 2020, 161-174.
- Derek C. Schuurman, , Perspectives on Science and Christian Faith, Volume 71, Number 2, June 2019, 75-82.
- Bryan W. House, David W. Capson, Derek C. Schuurman, , Proceedings of the IEEE International Symposium on Sustainable Systems and Technology (ISSST), May 2011.
- D.C. Schuurman and D.W. Capson, , IEEE Transactions on Robotics and Automation, April 2004, Volume 20, Issue 2, 319- 334.